페이지 정보
MEG-SS8B1
Wafer Spin Scrubber MEG-SS8B1
본문
Description | Specification |
---|---|
Wafer Size | Φ4~8” (100mm~200mm) |
Transfer Robot | Multi Transfer Unit IDR 2Arms, MTR 2Arms |
Process Method | PVA Brush Cleaning(APCS), PVA Bevel Brush Cleaning Ultra Sonic Cleaning, Jet Nano Spray (MC Spray) E-Flow System (CO2) |
Other | Followed Semi Standard |
OS | MS Windows10 Based, Ether-CAT |
FA | FDC, SECSII, GEM Automation |
Max speed | 300WPH |
Process Throughput | Front 6chamber Process Time 56/sec 250WPH Both (3Front, 3Back) Process Time 56/sec 140WPH |