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MEG-SS8B2
Wafer Spin Scrubber MEG-SS8B2
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| Description | Specification |
|---|---|
| Wafer Size | Φ6~8” (150mm~200mm) |
| Transfer Robot | Multi Transfer Unit IDR 4Arms, MTR 4Arms |
| Process Method | PVA Brush Cleaning(APCS), PVA Bevel Brush Cleaning Ultra Sonic Cleaning, Jet Nano Spray (MC Spray) E-Flow System (CO2) |
| Other | Followed Semi Standard |
| OS | MS Windows10 Based, Ether-CAT |
| FA | FDC, SECSII, GEM Automation |
| Max speed | 500WPH |
| Process Throughput | Front 8chamber Process Time 56/sec 430WPH Both (4Front, 4Back) Process Time 56/sec 270WPH |
