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MEG-SE8

Spin Single Cleaner MEG-SE8

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DescriptionSpecification
Wafer Size Φ4~8” (Si, GaAs, SIC, LNLT, Sapphire)
Transfer Robot Multi Transfer Unit
Process Method Al metal etchant, SC1, Ultra Sonic Cleaning
E-Flow System (CO2), Jet Nano Spray, (MC Spray)
OtherFollowed Semi Standard
OSMS Windows10 Based, Ether-CAT
FASECSII, GEM Automation
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