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MEG-SS8B1
Wafer Spin Scrubber MEG-SS8B1
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| Description | Specification |
|---|---|
| Wafer Size | Φ4~8” (100mm~200mm) |
| Transfer Robot | Multi Transfer Unit IDR 2Arms, MTR 2Arms |
| Process Method | PVA Brush Cleaning(APCS), PVA Bevel Brush Cleaning Ultra Sonic Cleaning, Jet Nano Spray (MC Spray) E-Flow System (CO2) |
| Other | Followed Semi Standard |
| OS | MS Windows10 Based, Ether-CAT |
| FA | FDC, SECSII, GEM Automation |
| Max speed | 300WPH |
| Process Throughput | Front 6chamber Process Time 56/sec 250WPH Both (3Front, 3Back) Process Time 56/sec 140WPH |
